Micro-Mechanics (Holdings) Ltd. (MCRNF) Research

Micro-Mechanics (Holdings) Ltd. specializes in engineering, producing, and distributing high-precision components and instruments vital for the wafer fabrication and assembly stages within the semiconductor industry. The company's operations span five geographical divisions: Singapore, Malaysia, the Philippines, the USA, and China. Its extensive product range addresses various aspects of semiconductor manufacturing. For instance, in die attach-pick-up processes, it offers items such as rubber tips, high-temperature plastic tools, tungsten carbide die collets, and vacuum wand tools. For die attach-dispensing, products include dispense nozzle adaptors, various dispense nozzles, and epoxy stamping tools, while die attach-die ejection components comprise ejector needles and associated seals. The company further provides a suite of bonding solutions, including clamps and electronic flame off products for thermosonic bonding, and clamps, bearing base assemblies, anvils, and wire cutters for ultrasonic bonding. Encapsulation needs are met with products like BGA dispensing nozzles, dispensing manifolds, pump screws, and O-rings. Additionally, Micro-Mechanics offers contract manufacturing services, crafting custom precision parts and assemblies for original equipment manufacturers (OEMs), and also develops specialized precision components and modules. The company was established in 1983 and is headquartered in Singapore.

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