Disco Corporation (DISPF) Research

Disco Corporation specializes in the global production and distribution of advanced machinery for precision cutting, grinding, and polishing applications. Its product portfolio encompasses a wide array of specialized equipment, such as dicing saws, laser saws, grinders, and polishers. It also offers wafer mounters, die separators, surface planers, and waterjet saws, alongside solutions for pre-grinding dicing and package singulation. Beyond the machines themselves, Disco provides essential precision processing tools like dicing blades, grinding wheels, and dry polishing wheels. Additionally, it supplies various supplementary items, including accessory equipment, frames, cassettes, and specialized additives for cutting fluids. The company further extends its services to include the dismantling and recycling of its precision machinery. It also delivers comprehensive training programs focused on product maintenance and operational proficiency. Moreover, Disco facilitates equipment access through machine leasing options and actively participates in the market for pre-owned machinery, both acquiring and reselling units. Established in 1937, Disco Corporation maintains its corporate headquarters in Tokyo, Japan.

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